OPA1654 datasheet(4/28 Pages) TI1

Part #	OPA1654

Description	Low Noise and Distortion, General-Purpose, FET-Input

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Manufacturer	TI1 [Texas Instruments]

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OPA1652

OPA1654

SBOS477

– DECEMBER 2011

www.ti.com

ELECTRICAL CHARACTERISTICS: VS = ±15 V (continued)

At TA = +25°C, RL = 2 kΩ, and VCM = VOUT = midsupply, unless otherwise noted.

OPA1652, OPA1654

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

TEMPERATURE

Specified range

–40

+85

°C

Operating range

–55

+125

°C

THERMAL INFORMATION: OPA1652

OPA1652

THERMAL METRIC(1)

D (SO)

DGK (MSOP)

UNITS

8 PINS

θJA

Junction-to-ambient thermal resistance

143.6

218.9

θJCtop

Junction-to-case (top) thermal resistance

76.9

78.6

θJB

Junction-to-board thermal resistance

61.8

103.7

°C/W

ψJT

Junction-to-top characterization parameter

27.8

14.6

ψJB

Junction-to-board characterization parameter

61.3

101.8

θJCbot

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA1654

OPA1654

THERMAL METRIC(1)

D (SO)

PW (TSSOP)

UNITS

14 PINS

θJA

Junction-to-ambient thermal resistance

90.1

126.9

θJCtop

Junction-to-case (top) thermal resistance

54.8

46.6

θJB

Junction-to-board thermal resistance

44.4

58.6

°C/W

ψJT

Junction-to-top characterization parameter

19.9

5.5

ψJB

Junction-to-board characterization parameter

44.2

57.8

θJCbot

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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Product Folder Link(s): OPA1652 OPA1654

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