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TAS5614LA Datasheet(PDF) 2 Page - Texas Instruments |
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TAS5614LA Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page 44 PIN DDV PACKAGE (TOP VIEW) VDD OC_ADJ RESET INPUT_A INPUT_B C_START DVDD GND GND GND GND AVDD INPUT_C INPUT_D FAULT OTW CLIP M1 M2 M3 GVDD_CD BST_C GVDD_AB GVDD_AB GND GND OUT_D OUT_D PVDD_CD PVDD_CD PVDD_CD OUT_C GND GND OUT_B PVDD_AB PVDD_AB PVDD_AB OUT_A OUT_A GND GND BST_B BST_A BST_D TAS5614LA SLAS846 – MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. GENERAL INFORMATION Terminal Assignment The TAS5614LA is available in a thermally enhanced package: • 44-Pin HTSSOP package (DDV) The package contains a PowerPAD™ that is located on the top side of the device for convenient thermal coupling to the heat sink. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TAS5614LA |
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