TLV71725PDBVT datasheet(10/23 Pages) TI1

Part #	TLV71725PDBVT

Description	150-mA, Low-Dropout Regulator with Foldback Current Limit for Portable Devices

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Manufacturer	TI1 [Texas Instruments]

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TLV717xx

TLV717xxP

SBVS176A – OCTOBER 2011 – REVISED APRIL 2012

www.ti.com

DROPOUT VOLTAGE

The TLV717xx uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout

voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the

RDS(ON) of the PMOS pass element. VDO scales approximately with output current because the PMOS device

behaves like a resistor in dropout. As with any linear regulator, PSRR and transient response are degraded as

(VIN – VOUT) approaches dropout.

TRANSIENT RESPONSE

As with any regulator, increasing the size of the output capacitor reduces over- and undershoot magnitude but

increases the duration of the transient response.

UNDERVOLTAGE LOCKOUT (UVLO)

The TLV717xx uses an undervoltage lockout circuit (UVLO = 1.6 V) to keep the output shut off until the internal

circuitry operates properly.

POWER DISSIPATION

The ability to remove heat from the die is different for each package type, presenting different considerations in

the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves

the heat from the device to ambient air. Performance data for JEDEC-low and high-K boards are given in the

Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device.

The addition, plated through-holes to heat-dissipating layers also improves heatsink effectiveness.

Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of

the output current and the voltage drop across the output pass element, as shown in Equation 1.

PD = (VIN – VOUT) × IOUT

(1)

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