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TPS2543 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS2543 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 34 page TPS2543 SLVSBA6 – FEBRUARY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TA PACKAGE DEVICE TOP-SIDE MARKING –40°C to 125°C QFN16 TPS2543 2543 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range, voltages are referenced to GND (unless otherwise noted) LIMIT UNIT Voltage range IN, EN, ILIM_LO, ILIM_HI, FAULT, STATUS, ILIM_SEL, –0.3 to 7 V CTL1, CTL2, CTL3, OUT IN to OUT –7 to 7 DP_IN, DM_IN, DP_OUT, DM_OUT –0.3 to (IN + 0.3) or 5.7 Input clamp current DP_IN, DM_IN, DP_OUT, DM_OUT ±20 mA Continuous current in SDP or CDP DP_IN to DP_OUT or DM_IN to DM_OUT ±100 mA mode Continuous current in BC1.2 DCP DP_IN to DM_IN ±50 mA mode Continuous output current OUT Internally limited Continuous output sink current FAULT, STATUS 25 mA Continuous output source current ILIM_LO, ILIM_HI Internally limited mA ESD rating HBM 2 kV HBM wrt GND and each other, DP_IN, DM_IN 8 CDM 500 V Operating junction temperature, TJ –40 to Internally limited °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPS2543 THERMAL METRIC(1) UNITS RTE (16 PIN) θJA Junction-to-ambient thermal resistance 53.4 θJCtop Junction-to-case (top) thermal resistance 51.4 θJB Junction-to-board thermal resistance 17.2 °C/W ψJT Junction-to-top characterization parameter 3.7 ψJB Junction-to-board characterization parameter 20.7 θJCbot Junction-to-case (bottom) thermal resistance 3.9 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS2543 |
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