TPS51463

SLUSAX2 – FEBRUARY 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

MINIMUM

ORDERING NUMBER

PINS

OUTPUT SUPPLY

ECO PLAN

QUANTITY

TPS51463RGER

24

Tape and reel

3000

Green (RoHS and

Plastic QFN

-40°C to 85°C

no Pb/Br)

(RGE)

TPS51463RGET

24

Mini reel

250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the TI

website at www.ti.com.

(2)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

THERMAL INFORMATION

TPS51463

UNITS

RGE (24) PIN

Junction-to-ambient thermal resistance

38.3

Junction-to-case (top) thermal resistance

44.7

Junction-to-board thermal resistance

16

°C/W

Junction-to-top characterization parameter

0.8

Junction-to-board characterization parameter

16.1

Junction-to-case (bottom) thermal resistance

5.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

VIN, EN, MODE

–0.3

7.0

V5DRV, V5FILT, VBST (with respect to SW)

–0.3

7.0

Input voltage range

VBST

–0.3

12.5

V

VID0, VID1

–0.3

3.6

VOUT

–1.0

3.6

SW

–2.0

7.0

SW (transient 20 ns and E=5 µJ)

–3.5

Output voltage range

COMP, SLEW, VREF

–0.3

3.6

V

PGND

–0.3

0.3

PGOOD

–0.3

7.0

Human Body Model (HBM)

2000

Electrostatic Discharge

V

Charged Device Model (CDM)

500

Storage temperature

–55

150

˚C

Junction temperature

–40

150

˚C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

˚C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2

Submit Documentation Feedback

Copyright © 2012, Texas Instruments Incorporated

Product Folder Link(s): TPS51463