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RH1573K Datasheet(PDF) 3 Page - Linear Technology |
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RH1573K Datasheet(HTML) 3 Page - Linear Technology |
3 / 13 page SPEC NO. 05-08-5223 REV. B RH1573K LOW DROPOUT PNP REGULATOR DRIVER DICE LINEAR TECHNOLOGY CORPORATION PAGE 3 OF13 3.4 The Absolute Maximum Ratings: Input Pin Voltage (VIN TO GND) . . . . . . . . . . . . . 10V Drive Pin Voltage (VDRIVE TO GND) . . . . . . . . . . . . . 10V Output Pin Voltage (VOUT TO GND) . . . . . . . . . . . . . 10V Shutdown Pin Voltage (VSHDN TO GND) . . . . . . . . . . . . 10V Operating Junction Temperature Range . . . . . -55°C to 125°C Storage Temperature Range . . . . . . . . . . -65°C to 150°C 3.5 Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and electrical requirements shall be specified herein. 3.6 Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall be specified in Figure 1. 3.7 Radiation Hardness Assurance (RHA): 3.7.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a guideline. 3.7.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the manufacturer will provide certified RAD testing and report through an independent test laboratory when required as a customer purchase order line item. 3.7.3 Total dose bias circuit is specified in Figure 2. 3.8 Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25 °C to the limits shown in Table I herein. All reject dice shall be removed from the lot. This testing is normally performed prior to dicing the wafer into chips. Final specifications after assembly are sample tested during the element evaluation. 3.9 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A, except for the following: Top side glassivation thickness shall be a minimum of 4KÅ. 3.10 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when specified as a customer purchase order line item. 3.11 Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality Conformance Inspection. 4.0 QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests and inspections specified herein. 5.0 SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and subjected to element evaluation per Table III herein. |
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