SPEC NO. 05-08-5223 REV. B

RH1573K LOW DROPOUT PNP REGULATOR DRIVER DICE

LINEAR TECHNOLOGY CORPORATION

3.4

The Absolute Maximum Ratings:

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10V

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10V

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10V

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10V

Operating Junction Temperature

Range

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-55°C to 125°C

Storage Temperature Range

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-65°C to 150°C

3.5

Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and

electrical requirements shall be specified herein.

3.6

Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall be

specified in Figure 1.

3.7

Radiation Hardness Assurance (RHA):

3.7.1

The manufacturer shall perform a lot sample test as an internal process monitor for total

dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019

Condition A as a guideline.

3.7.2

For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,

the manufacturer will provide certified RAD testing and report through an independent test

laboratory when required as a customer purchase order line item.

3.7.3

Total dose bias circuit is specified in Figure 2.

3.8

Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25

°C to the limits shown in Table I

herein. All reject dice shall be removed from the lot. This testing is normally performed prior to dicing

the wafer into chips. Final specifications after assembly are sample tested during the element

evaluation.

3.9

Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix

A, except for the following: Top side glassivation thickness shall be a minimum of 4KÅ.

3.10

Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of SEM

photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack

when specified as a customer purchase order line item.

3.11

Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality

Conformance Inspection.

4.0

QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests and

inspections specified herein.

5.0

SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and

subjected to element evaluation per Table III herein.