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AL8807 Datasheet(PDF) 3 Page - Diodes Incorporated |
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AL8807 Datasheet(HTML) 3 Page - Diodes Incorporated |
3 / 21 page AL8807 HIGH EFFICIENCY LOW EMI 36V 1A BUCK LED DRIVER AL8807 Document number: DS35281 Rev. 4 - 2 3 of 21 www.diodes.com June 2012 © Diodes Incorporated Electrical Characteristics VIN =12V, TA=25 oC, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VINSU Internal regulator start up threshold VIN rising 5.9 V VINSH Internal regulator hysteresis threshold VIN falling 100 300 mV IQ Quiescent current Output not switching (Note 2) 350 µA IS Input supply Current CTRL pin floating f = 250kHz 1.8 5 mA VTH Set current Threshold Voltage 95 100 105 mV VTH-H Set threshold hysteresis ±20 mV ISET SET pin input current VSET = VIN-0.1 16 22 µA RCTRL CTRL pin input resistance Referred to internal reference 50 k Ω VREF Internal Reference Voltage 2.5 V RDS(on) On Resistance of SW MOSFET ISW = 1A 0.25 0.4 Ω tR SW rise time VSENSE = 100±20mVfSW = 250kHz VSW = 0.1V~12V~0.1V CL = 15pF 12 ns tF SW fall time 20 ns ISW_Leakage Switch leakage current VIN =30V 0.5 μA θJA Thermal Resistance Junction-to- Ambient (Note 3) SOT25 (Note 4) 250 °C/W MSOP-8EP (Note 5) 69 ΨJL Thermal Resistance Junction-to- Lead (Note 6) SOT25 (Note 4) 50 θJC Thermal Resistance Junction-to- case (Note 7) MSOP-8EP (Note 5) 4.3 Notes: 2. AL8807 does not have a low power standby mode but current consumption is reduced when output switch is inhibited: VSENSE = 0V. Parameter is tested with VCTRL ≤ 2.5V 3. Refer to figure 35 for the device derating curve. 4. Test condition for SOT25: Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed. 5. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed 6. Dominant conduction path via Gnd pin (pin 2). 7. Dominant conduction path via exposed pad. |
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