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AL8807 Datasheet(PDF) 3 Page - Diodes Incorporated

Part # AL8807
Description  HIGH EFFICIENCY LOW EMI 36V 1A BUCK LED DRIVER
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AL8807 Datasheet(HTML) 3 Page - Diodes Incorporated

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AL8807
HIGH EFFICIENCY LOW EMI 36V 1A BUCK LED DRIVER
AL8807
Document number: DS35281 Rev. 4 - 2
3 of 21
www.diodes.com
June 2012
© Diodes Incorporated
Electrical Characteristics
VIN =12V, TA=25
oC, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VINSU
Internal regulator start up threshold VIN rising
5.9
V
VINSH
Internal regulator hysteresis
threshold
VIN falling
100
300
mV
IQ
Quiescent current
Output not switching (Note 2)
350
µA
IS
Input supply Current
CTRL pin floating f = 250kHz
1.8
5
mA
VTH
Set current Threshold Voltage
95
100
105
mV
VTH-H
Set threshold hysteresis
±20
mV
ISET
SET pin input current
VSET = VIN-0.1
16
22
µA
RCTRL
CTRL pin input resistance
Referred to internal reference
50
k
VREF
Internal Reference Voltage
2.5
V
RDS(on)
On Resistance of SW MOSFET
ISW = 1A
0.25
0.4
tR
SW rise time
VSENSE = 100±20mVfSW = 250kHz
VSW = 0.1V~12V~0.1V CL = 15pF
12
ns
tF
SW fall time
20
ns
ISW_Leakage
Switch leakage current
VIN =30V
0.5
μA
θJA
Thermal Resistance Junction-to-
Ambient (Note 3)
SOT25 (Note 4)
250
°C/W
MSOP-8EP (Note 5)
69
ΨJL
Thermal Resistance Junction-to-
Lead (Note 6)
SOT25 (Note 4)
50
θJC
Thermal Resistance Junction-to-
case (Note 7)
MSOP-8EP (Note 5)
4.3
Notes:
2. AL8807 does not have a low power standby mode but current consumption is reduced when output switch is inhibited: VSENSE = 0V. Parameter is
tested with VCTRL ≤ 2.5V
3. Refer to figure 35 for the device derating curve.
4. Test condition for SOT25: Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal
vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
5. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
6. Dominant conduction path via Gnd pin (pin 2).
7. Dominant conduction path via exposed pad.


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