bq24273

SLUSB08 – JUNE 2012

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

NTC MONITORING

PART NUMBER

OVP

JEITA COMPATIBLE

PACKAGE

(TS)

bq24273YFFR

10.5 V

Yes

Yes

WCSP

bq24273YFFT

10.5 V

Yes

Yes

WCSP

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

IN

–2

20

V

BYP, PMID, BOOT

–0.3

20

V

Pin voltage range (with

respect to VSS)

SW

–0.7

12

V

CS+, BAT, BGATE, DRV, STAT, INT, SDA, SCL, CD,TS

–0.3

7

V

BOOT to SW

–0.3

7

V

Output Current (Continuous)

SW

4.5

A

Input Current (Continuous)

IN

2.75

A

Output Sink Current

STAT, INT

10

mA

Operating free-air temperature range

–40

85

°C

–40

125

°C

–65

150

°C

Lead temperature (soldering, 10 s)

300

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

THERMAL INFORMATION

bq24273

UNITS

49 PINS (YFF)

Junction-to-ambient thermal resistance

49.8

Junction-to-case (top) thermal resistance

0.2

Junction-to-board thermal resistance

1.1

°C/W

Junction-to-top characterization parameter

1.1

Junction-to-board characterization parameter

6.6

Junction-to-case (bottom) thermal resistance

n/a

spacer

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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