0V Differential

QPx

QNx

Vring

V

OS

GND

CDCLVD1213

SCAS897 – JULY 2010

www.ti.com

Figure 9. Output Overshoot and Undershoot

Figure 10. Output AC Common Mode

APPLICATION INFORMATION

THERMAL MANAGEMENT

For reliability and performance reasons, the die temperature should be limited to a maximum of 125°C.

The device package has an exposed pad that provides the primary heat removal path to the printed circuit board

(PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a

ground plane must be incorporated into the PCB within the footprint of the package. The thermal pad must be

soldered down to ensure adequate heat conduction to the package. Figure 11 shows a recommended land and

via pattern.

Figure 11. Recommended PCB Layout

8

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