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LT1236ALS8 Datasheet(PDF) 8 Page - Linear Technology |
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LT1236ALS8 Datasheet(HTML) 8 Page - Linear Technology |
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8 / 16 page  LT1236LS8 8 1236ls8f applicaTions inForMaTion LT1236LS8 OUT GND IN LOAD R1 220 2N3906 R2* INPUT GROUND RETURN *OPTIONAL—REDUCES CURRENT IN OUTPUT SENSE LEAD: R2 = 2.4k 1236ls8 AI04 LT1236LS8 OUT IN GND KEEP THIS LINE RESISTANCE LOW LOAD + INPUT GROUND RETURN 1236ls8 AI03 use a star-ground method, with the LT1236LS8 ground tied directly to the load, rather than through a ground plane or other shared ground trace. This last method will reduce drop in the ground trace between the LT1236LS8 and the load. The ground wire in this case will carry only approximately 1mA, which is the ground current of the LT1236LS8, while the load return current will shunt to the system ground separate from the reference-to-load path. The following circuits show proper hook-up to minimize errors due to ground loops and line losses. Losses in the output lead can be greatly reduced by adding a PNP boost transistor if load currents are 5mA or higher. R2 can be added to further reduce current in the output sense lead. Effects of Air Movement on Low Frequency Noise The LT1236LS8 has very low noise because of the buried zener used in its design. In the 0.1Hz to 10Hz band, peak- to-peaknoiseisabout0.5ppmoftheDCoutput.Toachieve this low noise, however, care must be taken to shield the reference from ambient air turbulence. Air movement can createnoisebecauseofthermoelectricdifferencesbetween ICpackageleadsandprintedcircuitboardmaterialsand/or sockets. Power dissipation in the reference, even though it rarely exceeds 20mW, is enough to cause small tempera- ture gradients in the package leads. Variations in thermal resistance, caused by uneven air flow, create differential leadtemperatures,therebycausingthermoelectricvoltage noise at the output of the reference. Series Mode with Boost Transistor Standard Series Mode Long-Term Drift Long-term drift cannot be extrapolated from accelerated high temperature testing. This erroneous technique gives drift numbers that are wildly optimistic. The only way long-term drift can be determined is to measure it over the time interval of interest. The LT1236LS8 long-term drift data was collected on 80 parts that were soldered into printed circuit boards similar to a real world application. The boards were then placed into a constant temperature oven with a TA = 35°C, their outputs were scanned regularly and measured with an 8.5 digit DVM. Typical long-term drift is illustrated in Figure 1. Figure 1. Long-Term Drift HOURS 0 40 0 80 200 1236ls8 F01 –40 –80 –200 –160 160 –120 120 500 1000 1500 2000 NORMALIZED TO 10 HOURS DUE TO SYSTEM WARM-UP |
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