SN75LVCP600DRF

SLLSE63 – DECEMBER 2010

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AUTO LOW POWER (ALP) MODE (see Figure 10)

Auto Low Power (ALP) Mode is triggered when a channel is in the electrical idle state for >10 µs.

•

automatically enters the low power state. In this state the output is driven to VCM and the device selectively

shuts off internal circuitry to lower power by >90% of its normal operating power. While in ALP mode the

device continues actively to monitor input signal levels. When the input signal exceeds the SATA OOB upper

threshold level, the device reverts to the active state. Exit time from Auto Low Power Mode is <50 ns (max).

OUT-OF-BAND (OOB) SUPPORT

The squelch detector circuit within the device enables full detection of OOB signaling as specified in the SATA

indicating activity. Squelch circuit ON/OFF time is 5 ns max. While in squelch mode outputs are held to VCM.

DEVICE POWER

The SN75LVCP600 is designed to operate from a single 3.3 V supply. Always practice proper power supply

sequence is in reverse order.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

–0.5 to 4

V

Voltage range

Differential I/O

–0.5 to 4

V

Control I/O

V

Electrostatic discharge

±6000

V

±1500

V

±200

V

Continuous power dissipation

See Dissipation Rating Table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-B.

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101-A.

(5)

Tested in accordance with JEDEC Standard 22, Test Method A115-A.

THERMAL INFORMATION

SN75LVCP600

UNITS

DRF (8) PINS

Junction-to-ambient thermal resistance

97.8

Junction-to-case (top) thermal resistance

81.9

Junction-to-board thermal resistance

65.6

°C/W

Junction-to-top characterization parameter

1.3

Junction-to-board characterization parameter

65.6

Junction-to-case (bottom) thermal resistance

19.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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