THS7103

SLOS387 − DECEMBER 2001

8

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MECHANICAL DATA

VFP (S-PQFP-G32)

PowerPAD

 PLASTIC QUAD FLATPACK

4200791/A 04/00

Gage Plane

Seating Plane

1,60 MAX

1,45

1,35

8,80

9,20

SQ

0,05 MIN

0,45

0,75

0,25

0

°−7°

0,13 NOM

5,60 TYP

1

32

7,20

6,80

24

25

SQ

8

9

17

16

0,30

0,45

(See Note D)

Thermal Pad

M

0,22

0,10

0,80

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026

PowerPAD is a trademark of Texas Instruments.