TL750M SERIES

www.ti.com

SLVS021N – JANUARY 1988 – REVISED AUGUST 2010

ABSOLUTE MAXIMUM RATINGS

(1)

over virtual junction temperature range (unless otherwise noted)

MIN

MAX

UNIT

Continuous input voltage

26

V

Transient input voltage (see Figure 3)

60

V

Continuous reverse input voltage

–15

V

Transient reverse input voltage

t = 100 ms

–50

V

KCS package

22

KTT package

25.3

°C/W

KVU package

28

Virtual-junction temperature range

0

150

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

individual device electrical characteristics and thermal resistance, the built-in thermal-overload protection may be activated at power

levels slightly above or below the rated dissipation.

(3)

The package thermal impedance is calculated in accordance with JESD 51.

THERMAL INFORMATION

TL750M

UNITS

KCS (3 PINS)

KVU (3 PINS)

KTT (3 PINS)

Junction-to-ambient thermal resistance

28.7

50.9

27.5

Junction-to-case (top) thermal resistance

59.8

57.9

43.2

Junction-to-board thermal resistance

0.5

34.8

17.3

°C/W

Junction-to-top characterization parameter

5.3

6

2.8

Junction-to-board characterization parameter

0.4

23.7

9.3

Junction-to-case (bottom) thermal resistance

0.1

0.4

0.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

TL750M05

6

26

TL750M08

9

26

Input voltage

V

TL750M10

11

26

TL750M12

13

26

Output current

750

mA

Operating virtual-junction temperature

0

125

°C

Copyright © 1988–2010, Texas Instruments Incorporated

Submit Documentation Feedback

3