OPA2333-HT

SBOS483F – JULY 2009 – REVISED AUGUST 2012

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THERMAL CHARACTERISTICS FOR JD PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

64.9

Junction-to-ambient thermal

°C/W

No airflow

83.4

Junction-to-board thermal resistance High-K board without underfill

27.9

°C/W

Junction-to-case thermal resistance

6.49

°C/W

(1)

The intent of

This methodology is not meant to and will not predict the performance of a package in an application-specific environment.

(2)

JED51-7, high effective thermal conductivity test board for leaded surface mount packages

THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

to ceramic side of case

5.7

Junction-to-case thermal resistance

°C/W

to top of case lid (metal side of case)

13.7

THERMAL CHARACTERISTICS FOR D PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

Junction-to-case thermal resistance (to bottom of case)

39.4

°C/W

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

7

V

–0.3

(V+) + 0.3

V

Continuous

JD, HKJ, HKQ packages

–55

210

Operating temperature range

°C

D package

–55

175

JD, HKJ, HKQ packages

210

Junction temperature

°C

D package

175

Human-Body Model (HBM)

4000

ESD rating

V

Charged-Device Model (CDM)

1000

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short circuit to ground, one amplifier per package.

4

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