SN65HVD62

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SLLSE94A – SEPTEMBER 2011 – REVISED FEBRUARY 2012

RXIN

TXIN

RXOUT

COMMENT

H

H

Driver idle, no signal received

L

H

Driver active, no signal received (fault)

H

L

Driver idle, signal received

L

L

Driver active, signal received but ignored

(1)

H = High, L = Low

TXIN

RXIN

DIR

COMMENT (see Figure 5)

H

Idle for longer than DIR

L

Driver not active, no incoming message

Timeout

H

Active

H

Driver not active, incoming message, DIR stays High for DIR Timeout

L

Idle

—

This indicates a disconnection between TXOUT and RXIN

L

Active

L

Outgoing message, DIR stays Low for DIR Timeout

(1)

H = High, L = Low

ABSOLUTE MAXIMUM RATINGS

(1)

VALUES

–0.5 V to 6 V

Voltage range at coax pins

–0.5 V to 6 V

Voltage range at logic pins

Electrostatic Discharge, Human Body Model (EIA/JESD 22-A114)

±2 kV

Logic Output Current

–20 mA to 20 mA

TXOUT output current

Internally limited

SYNCOUT output current

Internally limited

170°C

Continuous total power dissipation

See Thermal Table

(1)

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress

ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended

operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

SN65HVD62

QFN

UNITS

(16) PINS

Junction-to-ambient thermal resistance

49.4

Junction-to-case (top) thermal resistance

64.2

Junction-to-board thermal resistance

22.9

°C/W

Junction-to-top characterization parameter

1.7

Junction-to-board characterization parameter

22.9

Junction-to-case (bottom) thermal resistance

25.0

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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