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SN74AC244-EP Datasheet(PDF) 1 Page - Texas Instruments |
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SN74AC244-EP Datasheet(HTML) 1 Page - Texas Instruments |
1 / 12 page www.ti.com FEATURES DW OR NS PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 DESCRIPTION SN74AC244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS723B – OCTOBER 2003 – REVISED APRIL 2006 • Controlled Baseline – One Assembly/Test Site, One Fabrication Site • Extended Temperature Performance of –55 °C to 125 °C • Enhanced Diminishing Manufacturing Sources (DMS) Support • Enhanced Product-Change Notification • Qualification Pedigree (1) • 2-V to 6-V V CC Operation • Inputs Accept Voltages to 6 V • Max t pd of 7.5 ns at 5 V (1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. This octal buffer and line driver is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74AC244-EP device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION ORDERABLE PART TA PACKAGE(1) TOP-SIDE MARKING NUMBER SOIC – DW Tape and reel SN74AC244MDWREP SAC244MEP –55 °C to 125°C SOP – NS Tape and reel SN74AC244MNSREP SAC244MEP (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (EACH BUFFER) INPUTS OUTPUT Y OE A L H H L L L H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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