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TPS81256SIPR Datasheet(PDF) 1 Page - Texas Instruments |
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TPS81256SIPR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 23 page 0 10 20 30 40 50 60 70 80 90 100 V I - Input Voltage - V IO - Output Current - m A . V = 5.0 V O C I C O L VIN EN VOUT GND L V OUT = 5.0 V DC/DC Converter TPS81256SIP ENABLE GND 4.7µF 16V X5R (0603) V IN 2.5 V .. 4.85 V TPS81256 www.ti.com SLVSAZ9 – JUNE 2012 3-W, HIGH EFFICIENCY STEP-UP CONVERTER IN MicroSiP™ PACKAGING Check for Samples: TPS81256 1 FEATURES DESCRIPTION 2 • 91% Efficiency at 4MHz Operation The TPS8125x device is a complete MicroSiP™ • Wide VIN Range From 2.5V to 5.5V DC/DC step-up power solution intended for battery- powered portable applications. Included in the • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V package are the switching regulator, inductor and • ±2% Total DC Voltage Accuracy input/output capacitors. Only a tiny additional output • 43µA Supply Current capacitor is required to finish the design. • Best-in-Class Line and Load Transient The TPS8125x is based on a high-frequency • VIN ≥ VOUT Operation synchronous step-up DC/DC converter optimized for battery-powered portable applications. • Low-Ripple Light-Load PFM Mode • True Load Disconnect During Shutdown The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode • Thermal Shutdown and Overload Protection operation at light load currents to maintain high • Sub 1-mm Profile Solution efficiency over the entire load current range. • Total Solution Size <9mm2 The PFM mode extends the battery life by reducing • 9-Pin MicroSiPTM Packaging the supply current to 43 μA (typ) during light load operation. Intended for low-power applications, the APPLICATIONS TPS8125x supports more than 3W output power over a full Li-Ion battery voltage range. Input current in • Cell Phones, Smart-Phones, Tablet PCs shutdown mode is less than 1µA (typ), which • Mono and Stereo APA Applications maximizes battery life. • USB-OTG, HDMI Applications The TPS8125x offers a very small solution size of • USB Charging Port (5V) less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment. Figure 2. Smallest Solution Size Application Figure 1. Efficiency vs. Load Current 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 MicroSiP is a trademark of Texas Instruments. UNLESS OTHERWISE NOTED this document contains Copyright © 2012, Texas Instruments Incorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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