0

10

20

30

40

50

60

70

80

90

100

V

I

- Input

Voltage

- V

Output

Current

- m

A

.

V = 5.0 V

O

C

I

C

O

L

VIN

EN

VOUT

GND

L

V

OUT

= 5.0 V

DC/DC Converter

TPS81256SIP

ENABLE

GND

4.7µF

16V X5R (0603)

V

IN

2.5 V .. 4.85 V

TPS81256

www.ti.com

SLVSAZ9 – JUNE 2012

3-W, HIGH EFFICIENCY STEP-UP CONVERTER IN MicroSiP™ PACKAGING

Check for Samples: TPS81256

1

FEATURES

DESCRIPTION

2

•

91% Efficiency at 4MHz Operation

The TPS8125x device is a complete MicroSiP™

•

DC/DC step-up power solution intended for battery-

powered

portable

applications.

Included

in

the

•

package are the switching regulator, inductor and

•

±2% Total DC Voltage Accuracy

input/output capacitors. Only a tiny additional output

•

43µA Supply Current

capacitor is required to finish the design.

•

Best-in-Class Line and Load Transient

The

TPS8125x

is

based

on

a

high-frequency

•

synchronous step-up DC/DC converter optimized for

battery-powered portable applications.

•

Low-Ripple Light-Load PFM Mode

•

True Load Disconnect During Shutdown

The DC/DC converter operates at a regulated 4-MHz

switching frequency and enters power-save mode

•

Thermal Shutdown and Overload Protection

operation at light load currents to maintain high

•

Sub 1-mm Profile Solution

efficiency over the entire load current range.

•

The PFM mode extends the battery life by reducing

•

the supply current to 43

μA (typ) during light load

operation. Intended for low-power applications, the

APPLICATIONS

TPS8125x supports more than 3W output power over

a full Li-Ion battery voltage range. Input current in

•

Cell Phones, Smart-Phones, Tablet PCs

shutdown mode is less than 1µA (typ), which

•

Mono and Stereo APA Applications

maximizes battery life.

•

USB-OTG, HDMI Applications

The TPS8125x offers a very small solution size of

•

USB Charging Port (5V)

components. The solution is packaged in a compact

(2.6mm x 2.9mm) and low profile (1.0mm) BGA

package

suitable

for

automated

assembly

by

standard surface mount equipment.

Figure 2. Smallest Solution Size Application

Figure 1. Efficiency vs. Load Current

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

MicroSiP is a trademark of Texas Instruments.

UNLESS

OTHERWISE

NOTED

this

document

contains

Copyright © 2012, Texas Instruments Incorporated

PRODUCTION DATA information current as of publication date.

Products conform to specifications per the terms of Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.