www.ti.com

FEATURES

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

5

4

A

B

GND

Y

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G32-EP

SINGLE 2-INPUT POSITIVE-OR GATE

SCES458D – DECEMBER 2003 – REVISED JUNE 2007

• Controlled Baseline

• I

Operation

–

One Assembly/Test Site, One Fabrication

Site

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• Extended Temperature Performance of –55°C

to 125

°C

• ESD Protection Exceeds JESD 22

• Enhanced Diminishing Manufacturing Sources

–

2000-V Human-Body Model (A114-A)

(DMS) Support

–

200-V Machine Model (A115-A)

• Enhanced Product-Change Notification

–

1000-V Charged-Device Model (C101)

• Supports 5-V V

• Inputs Accept Voltages to 5.5 V

• Max t

• Low Power Consumption, 10 μA Max I

CC

• ±24-mA Output Drive at 3.3 V

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE PART NUMBER

–40

°C to 85°C

SOT (SC-70) – DCK

Reel of 3000

SN74LVC1G32IDCKREP

CG0

SOT (SC-70) – DCK

Reel of 3000

SN74LVC1G32MDCKREP

BYB

–55

°C to 125°C

SOP (SOT-23) – DBV Reel of 3000

SN74LVC1G32MDBVREP

SBGM

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(3)

The actual top-side making has one additional character that designates the wafer fab/assembly site.

FUNCTION TABLE

INPUTS

OUTPUT

Y

A

B

H

X

H

X

H

H

L

L

L

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.