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TLV5535-Q1 Datasheet(PDF) 1 Page - Texas Instruments |
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TLV5535-Q1 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 36 page TLV5535Q1 8BIT, 35 MSPS, LOW POWER ANALOGTODIGITAL CONVERTER SGLS230A − JANUARY 2004 − REVISED JUNE 2008 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Meets AEC-Q100-011 C3A CDM Classification D Qualified for Automotive Applications D 8-Bit Resolution, 35 MSPS Sampling Analog-to-Digital Converter (ADC) D Low Power Consumption: 90 mW Typ Using External References D Wide Analog Input Bandwidth: 600 MHz Typ D 3.3-V Single-Supply Operation D 3.3-V TTL/CMOS-Compatible Digital I/O D Internal Bottom and Top Reference Voltages D Adjustable Reference Input Range D Power-Down (Standby) Mode D Separate Power Down for Internal Voltage References D Three-State Outputs D 28-Pin Thin Shrink SOP (TSSOP) Packages D Applications − Digital Communications (IF Sampling) − High-Speed DSP Front-End (TMS320C6000) − Video Processing (Scan Rate/Format Conversion) − DVD Read Channel Digitization description/ordering information The TLV5535 is an 8-bit, 35 MSPS, high-speed A/D converter. It converts the analog input signal into 8-bit binary-coded digital words up to a sampling rate of 35 MHz. All digital inputs and outputs are 3.3 V TTL /CMOS-compatible. The device consumes very little power due to the 3.3-V supply and an innovative single-pipeline architecture implemented in a CMOS process. The user obtains maximum flexibility by setting both bottom and top voltage references from user-supplied voltages. If no external references are available, on-chip references are available for internal and external use. The full-scale range is 1 Vpp up to 1.6 Vpp, depending on the analog supply voltage. If external references are available, the internal references can be disabled independently from the rest of the chip, resulting in an even greater power saving. ORDERING INFORMATION{ TJ PACKAGE} ORDERABLE PART NUMBER TOP-SIDE MARKING −40 °C to 85°C TSSOP (PW) Tape and reel TLV5535IPWRQ1 TLV5535Q1 † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. Copyright 2008 Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 DRVDD D0 D1 D2 D3 D4 D5 D6 D7 DRVSS DVSS CLK OE DVDD AVSS AVDD AIN CML PWDN_REF AVSS REFBO REFBI REFTI REFTO AVSS BG AVDD STBY PW PACKAGE (TOP VIEW) |
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