DAC3152

DAC3162

SLAS736D – NOVEMBER 2010 – REVISED AUGUST 2012

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ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

MIN

MAX

DVDD18, CLKVDD18

–0.5

2.3

V

VFUSE

–0.5

2.3

V

AVDD33

–0.5

4

V

D[11..0]P/N

–0.5

DVDD18 + 0.5

V

DACCLKP/N

–0.5

CLKVDD18 + 0.5 V

V

BIASJ, SLEEPB

–0.5

AVDD33 + 0.7 V

V

IOUTAP/N, IOUTBP/N

–1

AVDD33 + 0.7 V

V

Peak input current (any input)

±20

mA

Peak total input current (all inputs)

±30

mA

–40

85

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of these or any other conditions beyond those indicated under Recommended Operating Conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Measured with respect to GND

THERMAL INFORMATION

DAC3152

DAC3162

UNIT

RGZ (48 PINS)

Junction-to-ambient thermal resistance

28.9

Junction-to-case (top) thermal resistance

14.9

Junction-to-board thermal resistance

5.62

°C/W

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

5.6

Junction-to-case (bottom) thermal resistance

1.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

4

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