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TPS7A4001 Datasheet(PDF) 10 Page - Texas Instruments

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Part # TPS7A4001
Description  100V Input Voltage, 50mA, Very High Voltage LINEAR REGULATOR
Download  17 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS7A4001 Datasheet(HTML) 10 Page - Texas Instruments

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P
=(V
V
)I
-
D
IN
OUT
OUT
TPS7A4001
SBVS162A
– MARCH 2011 – REVISED MARCH 2011
www.ti.com
LAYOUT
PACKAGE MOUNTING
Any tendency to activate the thermal protection circuit
Solder
pad
footprint
recommendations
for
the
indicates
excessive
power
dissipation
or
an
TPS7A4001 are available at the end of this product
inadequate heatsink. For reliable operation, junction
data sheet and at www.ti.com.
temperature should be limited to a maximum of
+125
°C. To estimate the margin of safety in a
complete design (including heatsink), increase the
BOARD LAYOUT RECOMMENDATIONS TO
ambient temperature until the thermal protection is
IMPROVE PSRR AND NOISE PERFORMANCE
triggered; use worst-case loads and signal conditions.
To improve ac performance such as PSRR, output
For good reliability, thermal protection should trigger
noise, and transient response, it is recommended that
at least +35
°C above the maximum expected ambient
the board be designed with separate ground planes
condition
of
the
particular
application.
This
for IN and OUT, with each ground plane connected
configuration
produces
a
worst-case
junction
only at the GND pin of the device. In addition, the
temperature of +125
°C at the highest expected
ground connection for the output capacitor should
ambient temperature and worst-case load.
connect directly to the GND pin of the device.
The internal protection circuitry of the TPS7A4001
Equivalent series inductance (ESL) and ESR must be
has been designed to protect against overload
minimized in order to maximize performance and
conditions. It was not intended to replace proper
ensure stability. Every capacitor (CIN, COUT, CBYP)
heatsinking. Continuously running the TPS7A4001
must be placed as close as possible to the device
into thermal shutdown degrades device reliability.
and on the same side of the PCB as the regulator
itself.
POWER DISSIPATION
Do not place any of the capacitors on the opposite
The ability to remove heat from the die is different for
side of the PCB from where the regulator is installed.
each
package
type,
presenting
different
The
use
of
vias
and
long
traces
is
strongly
considerations in the PCB layout. The PCB area
discouraged
because
they
may
impact
system
around the device that is free of other components
performance negatively and even cause instability.
moves the heat from the device to the ambient air.
Performance data for JEDEC low- and high-K boards
If possible, and to ensure the maximum performance
are given in the Dissipation Ratings Table. Using
denoted in this product data sheet, use the same
heavier
copper
increases
the
effectiveness
in
layout pattern used for TPS7A40 evaluation board,
removing heat from the device. The addition of plated
available at www.ti.com.
through-holes to heat dissipating layers also improves
the heatsink effectiveness.
THERMAL PROTECTION
Power dissipation depends on input voltage and load
Thermal protection disables the output when the
conditions. Power dissipation (PD) is equal to the
junction temperature rises to approximately +170
°C,
product of the output current times the voltage drop
allowing the device to cool. When the junction
across the output pass element, as shown in
temperature cools to approximately +150
°C, the
Equation 2:
output circuitry is enabled. Depending on power
dissipation,
thermal
resistance,
and
ambient
(2)
temperature, the thermal protection circuit may cycle
on and off. This cycling limits the dissipation of the
regulator, protecting it from damage as a result of
overheating.
10
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Copyright
© 2011, Texas Instruments Incorporated
Product Folder Link(s): TPS7A4001


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