TPS40200-HT

www.ti.com

SGLS400B – OCTOBER 2009 – REVISED MAY 2010

Table 1. Bond Pad Coordinates in Microns

DISCRIPTION

PAD NUMBER

X min

Y min

X max

Y max

RC

1

63.27

1124.01

164.07

1224.81

SS

2

61.20

922.77

162.00

1023.57

COMP

3

61.20

250.38

162.00

351.18

FB

4

70.20

74.16

171.00

174.96

GND

5

1193.94

91.44

1294.74

192.24

GDRV

6

1188.90

245.34

1289.70

346.14

ISNS

7

1189.80

978.30

1290.60

1079.10

VDD

8

1137.60

1148.49

1238.40

1249.29

Table 2. Test Pad Coordinates in Microns

DISCRIPTION

PAD NUMBER

X min

Y min

X max

Y max

NC

1

189.00

27.18

256.50

94.68

NC

2

292.86

27.18

360.36

94.68

NC

3

396.72

27.18

464.22

94.68

NC

4

517.77

27.18

585.27

94.68

NC

5

757.71

27.27

825.21

94.77

ORDERABLE PART NUMBER

–55°C to 175°C

D

TPS40200HD

KGD

TPS40200SKGD1

–55°C to 210°C

HKJ

TPS40200SHKJ

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Copyright © 2009–2010, Texas Instruments Incorporated

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3

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