TPS84250RKGT datasheet(4/29 Pages) TI1

Part #	TPS84250RKGT

Description	7-V to 50-V Input, 2.5-A Step-Down, Integrated Power Solution

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Manufacturer	TI1 [Texas Instruments]

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PWRGD

VIN

PGND

PH

VOUT

RT/CLK

VADJ

STSEL

SS/TR

TPS84250

PWRGD

Logic

+

VREF

Comp

Power

Stage

and

Control

Logic

Thermal Shutdown

Shutdown

Logic

OCP

VIN

UVLO

OSC w/PLL

AGND

INH/UVLO

TPS84250

SLVSAR6 – AUGUST 2012

www.ti.com

THERMAL INFORMATION

TPS84250

THERMAL METRIC(1)

RKG

UNIT

41 PINS

θJA

Junction-to-ambient thermal resistance(2)

14

ψJT

Junction-to-top characterization parameter(3)

3.3

°C/W

ψJB

Junction-to-board characterization parameter(4)

6.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance,

θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided, 4-layer PCB

with 1 oz. copper and natural convection cooling. Additional airflow reduces

θJA.

(3)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature, TJ, of a device in a real system, using a

procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is

the temperature of the top of the device.

(4)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature, TJ, of a device in a real system, using a

procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is

the temperature of the board 1mm from the device.

DEVICE INFORMATION

FUNCTIONAL BLOCK DIAGRAM

4

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