17 18 19

JTDI

SYNC/PASS

GND

RD0

RD1

RD2

VDD

RD3

RD4

RD5

RD6

VDD

RD7

RD8

RD9

GND

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

20

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

GND

TD0

TD1

TD2

VDD

TD3

TD4

TD5

TD6

VDD

TD7

TD8

TD9

GND

MODESEL

PRBSEN

21 22 23 24

63 62 61 60 59

64

58

56 55 54

57

25 26 27 28 29

53 52 51 50 49

30 31 32

TLK1211RCP

www.ti.com

SLLS658D

– SEPTEMBER 2006 – REVISED APRIL 2011

ETHERNET TRANSCEIVERS

Check for Samples: TLK1211RCP

1

FEATURES

•

Advanced 0.25-

μm CMOS Technology

•

No External Filter Capacitors Required

2

•

0.6-Gbps to 1.3-Gbps Serializer/Deserializer

•

Comprehensive Suite of Built-In Testability

•

Low Power Consumption

<250 mW (typ) at

1.25 Gbps

•

IEEE 1149.1 JTAG Support

•

Fast Relock Times Less Than 256 ns (Typ)

•

2.5-V Supply Voltage for Lowest Power

Suitable for EPON/GEPON Applications

Operation

•

LVPECL Compatible Differential I/O on High

•

3.3-V Tolerant on LVTTL Inputs

Speed Interface

•

Hot Plug Protection

•

Single Monolithic PLL Design

•

64-Pin VQFP With Thermally Enhanced

•

Support For 10-Bit Interface or Reduced

Package ( PowerPAD

™)

Interface 5-Bit DDR (Double Data Rate)

•

CPRI Data Rate Compatible (614 Mbps,

Clocking

1.22 Gbps)

•

Receiver Differential Input Thresholds 200 mV

•

Industrial Temperature Range

Minimum

Supported:

–40°C to 85°C

•

IEEE 802.3 Gigabit Ethernet Compliant

•

ANSI X3.230-1994 (FC-PH) Fibre Channel

Compliant

DESCRIPTION

The TLK1211RCP gigabit ethernet transceiver provides for ultrahigh-speed, full-duplex, point-to-point data

transmissions. This device is based on the timing requirements of the 10-bit interface specification by the IEEE

802.3 gigabit ethernet specification and is also compliant with the ANSI X3.230-1994 (FC-PH) fibre channel

standard. The device supports data rates from 0.6 Gbps to 1.3 Gbps.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright

© 2006–2011, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.