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TMP320C31KGDB Datasheet(PDF) 3 Page - Texas Instruments |
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TMP320C31KGDB Datasheet(HTML) 3 Page - Texas Instruments |
3 / 9 page TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB FLOATINGPOINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS023B − APRIL 1997 − REVISED OCTOBER 2001 3 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 JEDEC STANDARD D Die thickness is approximately 15 mils ± 1 mil. D Backside surface finish is silicon. D Maximum allowable die junction operating temperature is 175°C. D Glassivation material is compressive nitride. D Bond pad metal is composed of copper-doped aluminum. D Percentage of defect allowed for burned-in die is 5%. D Life test data is available. D Configuration control notification. D Group A attribute summary is available (SMJ only). D Suggested die-attach material is silver glass (QMI 2569F). D Suggested bond wire size is 1.25 mils. D Suggested bonding method is gold-ball bonding. D ESD rating is Class II. D Maximum allowable peak process temperature for die attach is 440°C ± 5°C (for QMI 2569F). D Saw kerf is dependent on blade size used. D Die backside potential is grounded. |
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