TSC2004_12 datasheet(5/58 Pages) BURR-BROWN

Part #	TSC2004

Description	1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire

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Manufacturer	BURR-BROWN [Burr-Brown (TI)]

Direct Link	http://www.burr-brown.com

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PIN CONFIGURATIONS

X

Y

SNSGND

NC

AD0

-

TSC2004

16

17

18

19

20

10

9

8

7

6

ThermalPad

1

2

3

4

5

15

14

13

12

11

AGND

AUX

NC

I/OVDD

DGND

Columns

(FRONT

VIEW)

A

C

E

B

D

NC

AD1

SNSGND

NC

DGND

4

NC

Y

-

I/OVDD

3

SUBGND

NC

X

-

AUX

2

X+

VREF

Y+

SNSVDD

AGND

1

SDA

PINTDAV

AD0

SCL

RESET

5

NC

TSC2004

SBAS408E – JUNE 2007 – REVISED MARCH 2008

RTJ PACKAGE(1)

YZK PACKAGE

QFN-20

WCSP-18

(TOP VIEW)

(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)

(1)

The thermal pad is internally connected to

SUBGND.

The

thermal

pad

can

be

connected to the analog ground or left

floating. Keep the thermal pad separate

from the digital ground, if possible.

PIN ASSIGNMENTS

PIN NO.

QFN

WCSP

NAME

I/O

A/D

DESCRIPTION

1

D1

SDA

I/O

D

Serial data I/O

2

C1

SCL

I

D

Serial clock.

3

B2

AD1

I

D

Address input bit 1

4

A1

PINTDAV

O

D

Interrupt output. Data available or PENIRQ, depending on setting. Pin polarity with active low.

5

B1

RESET

I

D

System reset. All register values reset to default values.

6

A2

DGND

Digital ground

7

A3

I/OVDD

Digital I/O interface voltage

B3, B4,

No internal connection, but solder bumps are populated. These pins may be connected to analog ground

8, 19

C2, C3,

NC

for mechanical stability.

D2, D3

9

A4

AUX

I

A

Auxiliary channel input

10

A5

AGND

Analog ground

11

B5

VREF

I

A

External reference input

12

C5

SNSVDD

Power supply for sensor drivers and other analog blocks.

13

D5

X+

I

A

X+ channel input

14

E5

Y+

I

A

Y+ channel input

15

D4

SUBGND

Substrate ground (for ESD current). Connection to AGND (on the PCB) is recommended.

16

E4

X–

I

A

X– channel input

17

E3

Y–

I

A

Y– channel input

18

E2

SNSGND

Sensor driver return

20

E1

AD0

I

D

Address input bit 0

—

C4

NC

No solder bump for this location.

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