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TMP47C206PG Datasheet(PDF) 3 Page - Toshiba Semiconductor |
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TMP47C206PG Datasheet(HTML) 3 Page - Toshiba Semiconductor |
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3 / 50 page  TMP47C206 II 2008-03-06 1. Part number 2. Package code and dimensions Previous Part Number (in Body Text) Previous Package Code (in Body Text) New Part Number New Package Code OTP TMP47C206P P-DIP20-300-2.54A TMP47C206PG DIP20-P-300-2.54A TMP47P206VPG TMP47C206M P-SOP20-300-1.27 TMP47C206MG SOP20-P-300-1.27 TMP47P206VMG *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Test Conditions Remark Solderability (1) Use of Lead (Pb) · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Lead (Pb)-Free · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux Leads with over 95% solder coverage till lead forming are acceptable. 4. RESTRICTIONS ON PRODUCT USE The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text. 5. Publication date of the datasheet The publication date of this datasheet is printed at the lower right corner of this notification. RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. • For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter entitled Quality and Reliability Assurance/Handling Precautions. |
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