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CM300DX-24S Datasheet(PDF) 3 Page - Mitsubishi Electric Semiconductor |
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CM300DX-24S Datasheet(HTML) 3 Page - Mitsubishi Electric Semiconductor |
3 / 9 page MITSUBISHI IGBT MODULES CM300DX-24S HIGH POWER SWITCHING USE INSULATED TYPE 3 Feb. 2011 ELECTRICAL CHARACTERISTICS (cont.; Tj=25 °C, unless otherwise specified) NTC THERMISTOR PART Limits Symbol Item Conditions Min. Typ. Max. Unit R25 Zero-power resistance TC=25 °C (Note.2) 4.85 5.00 5.15 kΩ ΔR/R Deviation of resistance TC=100 °C, R100=493 Ω -7.3 - +7.8 % B(25/50) B-constant Approximate by equation (Note.6) - 3375 - K P25 Power dissipation TC=25 °C (Note.2) - - 10 mW THERMAL RESISTANCE CHARACTERISTICS Limits Symbol Item Conditions Min. Typ. Max. Unit Rth(j-c)Q Junction to case, per Inverter IGBT - - 0.066 K/W Rth(j-c)D Thermal resistance (Note.2) Junction to case, per Inverter FWDi - - 0.12 K/W Case to heat sink, per 1 module, Rth(c-s) Contact thermal resistance (Note.2) Thermal grease applied (Note.7) - 15 - K/kW MECHANICAL CHARACTERISTICS Limits Symbol Item Conditions Min. Typ. Max. Unit Mt Main terminals M 6 screw 3.5 4.0 4.5 Ms Mounting torque Mounting to heat sink M 5 screw 2.5 3.0 3.5 N·m Terminal to terminal 11.55 - - ds Creepage distance Terminal to base plate 12.32 - - mm Terminal to terminal 10.00 - - da Clearance Terminal to base plate 10.85 - - mm m Weight - - 350 - g ec Flatness of base plate On the centerline X, Y (Note.8) ±0 - +100 μm Note.1: Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi). Note.2: Case temperature (TC) and heat sink temperature (T s ) are defined on the each surface (mounting side) of base plate and heat sink just under the chips. Refer to the figure of chip location. The heat sink thermal resistance should measure just under the chips. Note.3: Pulse width and repetition rate should be such that the device junction temperature (T j ) dose not exceed T jm a x rating. Note.4: Junction temperature (T j ) should not increase beyond T jm a x rating. Note.5: Pulse width and repetition rate should be such as to cause negligible temperature rise. Refer to the figure of test circuit for VCEsat, VEC. Note.6: ) T T /( ) R R ln( B ) / ( 50 25 50 25 50 25 1 1 R25: resistance at absolute temperature T25 [K]; T25=25 [°C]+273.15=298.15 [K] R50: resistance at absolute temperature T50 [K]; T50=50 [°C]+273.15=323.15 [K] Note.7: Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K). Note.8: The base plate (mounting side) flatness measurement points (X, Y) are as follows of the following figure. Y X +:Convex -:Concave mounting side mounting side mounting side Note.9: Japan Electronics and Information Technology Industries Association (JEITA) standards, "EIAJ ED-4701/300: Environmental and endurance test methods for semiconductor devices (Stress test I)" Note.10: Use the following screws when mounting the printed circuit board (PCB) on the stand offs. "M2.6×10 or M2.6×12 self tapping screw" The length of the screw depends on the thickness of the PCB. |
Similar Part No. - CM300DX-24S |
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Similar Description - CM300DX-24S |
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