< IGBT MODULES >

CM1400DUC-24S

HIGH POWER SWITCHING USE

INSULATED TYPE

July-2012

3

TENTATIVE

THERMAL RESISTANCE CHARACTERISTICS

Limits

Symbol

Item

Conditions

Min.

Typ.

Max.

Unit

Junction to case, per Inverter IGBT

-

-

16

Thermal resistance

(Note4)

Junction to case, per Inverter FWDi

-

-

26

K/kW

Case to heat sink, per 1 module,

Contact thermal resistance

(Note4)

-

6

-

K/kW

MECHANICAL CHARACTERISTICS

Limits

Symbol

Item

Conditions

Min.

Typ.

Max.

Unit

Main terminals

M 6 screw

3.5

4.0

4.5

Mounting torque

Mounting to heat sink

M 6 screw

3.5

4.0

4.5

N·m

Terminal to terminal

24

-

-

Creepage distance

Terminal to base plate

33

-

-

mm

Terminal to terminal

14

-

-

Clearance

Terminal to base plate

33

-

-

mm

m

Weight

-

-

1450

-

g

Flatness of base plate

-50

-

+100

μm

Note1. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).

just under the chips. Refer to the figure of chip location.

5. Pulse width and repetition rate should be such as to cause negligible temperature rise.

Refer to the figure of test circuit.

6. Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K).

7. The base plate (mounting side) flatness measurement points (X, Y1, Y2) are as follows of the following figure.

+: Convex

-: Concave

Bottom

Bottom

Label side

Bottom

Y1

X

Y2

36 mm

36 mm

8. The company name and product names herein are the trademarks and registered trademarks of the respective companies.