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CM1400DUC-24S Datasheet(PDF) 3 Page - Mitsubishi Electric Semiconductor |
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CM1400DUC-24S Datasheet(HTML) 3 Page - Mitsubishi Electric Semiconductor |
3 / 9 page < IGBT MODULES > CM1400DUC-24S HIGH POWER SWITCHING USE INSULATED TYPE July-2012 3 TENTATIVE THERMAL RESISTANCE CHARACTERISTICS Limits Symbol Item Conditions Min. Typ. Max. Unit Rth(j-c)Q Junction to case, per Inverter IGBT - - 16 Rth(j-c)D Thermal resistance (Note4) Junction to case, per Inverter FWDi - - 26 K/kW Case to heat sink, per 1 module, Rth(c-s) Contact thermal resistance (Note4) Thermal grease applied (Note7) - 6 - K/kW MECHANICAL CHARACTERISTICS Limits Symbol Item Conditions Min. Typ. Max. Unit Mt Main terminals M 6 screw 3.5 4.0 4.5 Ms Mounting torque Mounting to heat sink M 6 screw 3.5 4.0 4.5 N·m Terminal to terminal 24 - - ds Creepage distance Terminal to base plate 33 - - mm Terminal to terminal 14 - - da Clearance Terminal to base plate 33 - - mm m Weight - - 1450 - g ec Flatness of base plate On the centerline X, Y1, Y2 (Note5) -50 - +100 μm Note1. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi). 2. Junction temperature (T j ) should not increase beyond T jm ax rating. 3. Pulse width and repetition rate should be such that the device junction temperature (T j ) dose not exceed T jm a x rating. 4. Case temperature (TC) and heat sink temperature (T s ) are defined on the each surface (mounting side) of base plate and heat sink just under the chips. Refer to the figure of chip location. 5. Pulse width and repetition rate should be such as to cause negligible temperature rise. Refer to the figure of test circuit. 6. Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K). 7. The base plate (mounting side) flatness measurement points (X, Y1, Y2) are as follows of the following figure. +: Convex -: Concave Bottom Bottom Label side Bottom Y1 X Y2 36 mm 36 mm 8. The company name and product names herein are the trademarks and registered trademarks of the respective companies. |
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