PM50B6LB060_09 datasheet(1/10 Pages) MITSUBISHI

Part #	PM50B6LB060

Description	FLAT-BASE TYPE INSULATED PACKAGE

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Manufacturer	MITSUBISHI [Mitsubishi Electric Semiconductor]

Direct Link	http://www.mitsubishichips.com

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Jun. 2007

MITSUBISHI <INTELLIGENT POWER MODULES>

PM50B6LB060

FLAT-BASE TYPE

INSULATED PACKAGE

PM50B6LB060

FEATURE

a) Adopting new 5th generation IGBT (CSTBT

TM ) chip, which

performance is improved by 1µm fine rule process.

For example, typical Vce(sat)=1.55V @Tj=125°C

b) Over-temperature protection by detecting Tj of the CSTBT

TM

chips and error output is possible from all each conserva-

tion upper and lower arm of IPM.

c) New small package

Reduce the package size by 10%, thickness by 22% from

S-DASH series.

•2φ 50A, 600V Current-sense IGBT type inverter

• 50A, 600V Current-sense Chopper IGBT

• Monolithic gate drive & protection logic

• Detection, protection & status indication circuits for, short-

circuit, over-temperature & under-voltage (P-Fo available

from upper arm devices)

• UL Recognized

Yellow Card No.E80276(N)

File No.E80271

APPLICATION

Photo voltaic power conditioner

PACKAGE OUTLINES

Dimensions in mm

22

7.75

98.25

2.5

23

19.5

L A B E L

17

16

3

9.5

1.5

1. VUPC

2. UFO

3. UP

4. VUP1

5. VVPC

6. VFO

7. VP

8. VVP1

9. NC

10. NC

11. NC

12. NC

13. VNC

14. VN1

15. Br

16. UN

17. VN

18. WN

19. Fo

Terminal code

19-

■0.5

106 ±0.25

66.5

19.75

3.25

7

4

44

4

16

15.25

6-2

3-2

16

120

15

BU

V

W

913

19

4-φ

2.5

MOUNTING HOLES

2-

φ5.5

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