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TPS1045B-Y Datasheet(PDF) 4 Page - STMicroelectronics |
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TPS1045B-Y Datasheet(HTML) 4 Page - STMicroelectronics |
4 / 7 page Characteristics STPS1045B-Y 4/7 Doc ID 17265 Rev 1 Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 45 1E-1 1E+0 1E+1 1E+2 1E+3 1E+4 1E+5 I (µA) R V (V) R T =125°C j T =150°C j T =100°C j T =50°C j T =25°C j T =75°C j 12 5 10 20 50 100 200 500 1000 C(pF) V (V) R F=1MHz V =30mV T =25°C OSC RMS j Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under tab 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 T =125°C (maximum values) j T =125°C (typical values) j T =25°C (maximum values) j I (A) FM V (V) FM 0 2 4 6 8 10121416 1820 0 20 40 60 80 100 Rth(j-a)(°C/W) S(Cu)(cm ) 2 Epoxy printed circuit board, copper thickness: 35 µm |
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