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1210L300SL Datasheet(PDF) 4 Page - Littelfuse |
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1210L300SL Datasheet(HTML) 4 Page - Littelfuse |
4 / 7 page Revised: October 9, 2012 POLY-FUSE ® Resettable PTCs © 2012 Littelfuse, Inc. Lo Rho Series Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/LoRho.html for current information. Surface Mount > LoRhoTM Series Temperature Rerating Curve -40 -30 -20 -10 0 10 20 30 40 5060 70 80 10% 30% 50% 70% 90% 110% 130% 150% 170% Temperature (°C) Environmental Specifications Operating Temperature -40°C to +85°C Maximum Device Surface Temperature in Tripped State 125°C Passive Aging +85°C, 1000 hours -/+10% typical resistance change Humidity Aging +85°C, 85% R.H.,100 hours -/+15% typical resistance change Thermal Shock MIL–STD–202, Method 107G +85°C/-40°C 20 times -30% typical resistance change Solvent Resistance MIL–STD–202, Method 215 No change Vibration MIL–STD–883C, Method 2007.1, Condition A No change Moisture Sensitivity Level Level 1, J–STD–020C Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3. Soldering Parameters Profile Feature Pb-Free Assembly Average Ramp-Up Rate (T S(max) to TP) 3°C/second max Pre Heat: Temperature Min (T s(min)) 150°C Temperature Max (T s(max)) 200°C Time (Min to Max) (t s) 60 – 180 secs Time Maintained Above: Temperature (T L) 217°C Temperature (t L) 60 – 150 seconds Peak / Classification Temperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T P) 8 minutes Max. -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N 2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices |
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