MAX19792 datasheet(2/23 Pages) MAXIM

Part #	MAX19792

Description	500MHz to 4000MHz Dual Analog Voltage Variable Attenuator with On-Chip 10-Bit SPI-Controlled DAC

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Manufacturer	MAXIM [Maxim Integrated Products]

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Maxim Integrated

MAX19792

500MHz to 4000MHz Dual Analog Voltage Variable

Attenuator with On-Chip 10-Bit SPI-Controlled DAC

VCC.......................................................................-0.3V to +5.5V

REF_IN..............................-0.3V to Minimum (VCC + 0.3V, 3.6V)

REF_SEL, DAC_LOGIC, MODE, DWN, UP,

DIN, CLK, CS............... -0.3V to Minimum (VCC + 0.3V, 3.6V)

COMP_OUT, DOUT..............................................-0.3V to +3.6V

IN_A, OUT_A, IN_B, OUT_B .......................-0.3V to VCC + 0.3V

CTRL (except for test mode).......................-0.3V to VCC + 0.3V

Maximum CTRL Pin Load Current

(CTRL configured as an output)....................................0.3mA

RF Input Power at IN_A, IN_B, OUT_A, OUT_B ........... +20dBm

Continuous Power Dissipation (Note 1) ..............................2.8W

Operating Case Temperature Range (Note 2)…-40NC to +100NC

Maximum Junction Temperature.....................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ABSOLUTE MAXIMUM RATINGS

Note 3: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150NC.

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Note 1: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.

The junction temperature must not exceed +150NC.

Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

TQFN

Junction-to-Ambient Thermal Resistance (

qJA)

(Notes 3, 4)............................................................... +36NC/W

Junction-to-Case Thermal Resistance (

qJC)

(Notes 1, 4)............................................................... +10NC/W

PACKAGE THERMAL CHARACTERISTICS

3.3V DC ELECTRICAL CHARACTERISTICS

(VCC = 3.15V to 3.45V, VCTRL = 1V, VDAC_LOGIC = 0V, RDBK_EN(D9, REG3) = logic 0, no RF signals applied, all input and output

ports terminated with 50I through DC blocks, TC = -40NC to +100NC, unless otherwise noted. Typical values are at VCC = 3.3V,

VCTRL = 1V, VDAC_LOGIC = 0V, RDBK_EN(D9, REG3) = logic 0, TC = +25NC, unless otherwise noted.) (Note 5)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

3.15

3.3

3.45

V

Supply Current

ICC

9.5

14

mA

Control Voltage Range

VCTRL

1

2.5

V

CTRL Input Resistance

RCTRL

1.0

MI

Input Current Logic-High

IIH

-1

+1

µA

Input Current Logic-Low

IIL

-1

+1

µA

REF_IN Voltage

1.4

V

REF_IN Input Resistance

1.0

MI

DAC Number of Bits

Monotonic

10

Bits

Input Voltage Logic-High

VIH

2

V

Input Voltage Logic-Low

VIL

0.8

V

COMP_OUT Logic-High

RDBK_EN(D9, REG3) = logic 1,

RLOAD = 47kI

3.3

V

COMP_OUT Logic-Low

RDBK_EN(D9, REG3) = logic 1,

RLOAD = 47kI

0

V

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