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AN-793 Datasheet(PDF) 1 Page - Analog Devices |
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AN-793 Datasheet(HTML) 1 Page - Analog Devices |
1 / 8 page AN-793 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com ESD/Latch-Up Considerations with iCoupler® Isolation Products by Rich Ghiorse INTRODUCTION Analog Devices iCoupler products offer an alternative iso- lation solution to optocouplers with superior integration, performance, and power consumption characteristics. An iCoupler isolation channel consists of CMOS input and output circuits and a chip scale transformer (see Figure 1). Because the iCoupler employs CMOS technology, it can be more vulnerable to latch-up or electrostatic discharge (ESD) damage than an optocoupler when subjected to system-level ESD, surge voltage, fast transient, or other overvoltage conditions. Figure 1. ADuM140x Quad Isolator This application note provides guidance for avoiding these problems. Examples are presented for various system-level test configurations showing mechanisms that may impact performance. For each example recom- mended solutions are given. Later this year, Analog Devices is introducing hardened versions of most iCoupler products that will have improved immunity to latch-up and electrical overstress (EOS). This new product family, the ADuM3xxx series, will be pin-compatible with the existing ADuM1xxx series products and will offer identical performance specifications. Both product families will continue to be made available. Components vs. Systems Simply put, a component is a single integrated device with interconnects while a system is a nonintegrated device built from several interconnected components. In almost all cases the distinction between a component and a system is obvious. However, the differences between component and system tests may not be so obvious. Further, component specifications may not directly indicate how a device will perform in system-level testing. ESD testing is a good example of this. ESD, surge, burst, and fast transient events are facts of life in electronic applications. These events generally consist of high voltage, short duration spikes applied directly or indirectly to a device. These events arise from interaction of the device to real-world phenomena, such as human contact, ac line perturbations, lightning strikes, or common-mode voltage differences between system grounds. Component-level ESD testing is most useful in deter- mining a device’s robustness to handling by humans and automated assembly equipment prior and during assembly into a system. Component-level ESD data is less useful in determining a device’s robustness within a system subjected to system-level ESD events. There are two reasons for this. • System- and component-level ESD testing have different objectives. Component-level testing seeks to address conditions typically endured during com- ponent handling and assembly. System-level testing seeks to address conditions typically endured during system operation. • The specific conditions a component is subjected to during system-level testing can be a strong func- tion of the board/module/system design in which it resides. For example, long inductive traces between a system and component ground can actually impose a more severe voltage transient onto a component than is imposed on the system at the test point. REV. 0 |
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