© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FIN424C / FIN425C • Rev. 1.0.0

9

Physical Dimensions

5.00

5.00

0.80 MAX

0.10 C

SEATING

PLANE

0.08 C 0.05

0.00

(0.20)

C

0.15 C

0.15 C

PIN #1 IDENT

0.50

PIN #1 IDENT

3.70

3.50

0.45

0.35

3.70

3.50

0.50

0.10

CA B

0.05

C

0.18-0.30

A

B

5.38 MIN

0.20MIN

3.86 MIN

3.37 MAX

0.28 MAX

0.50TYP

(0.76)

X4

X40

E

(DATUM B)

(DATUM A)

PIN #1 ID

PIN #1 ID

(0.25 )

NOTES:

A. CONFORMS TO JEDEC REGISTRATION MO-220, VARIATION

WHHD-4. THIS PACKAGE IS ALSO FOOTPRINT COMPATIBLE WITH

WHHD-5.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994.

D. LAND PATTERN PER IPC SM-782.

E. WIDTH REDUCED TO AVOID SOLDER BRIDGING.

F. DIMENSIONS ARE NOT INCLUSIVE OF BURRS, MOLD FLASH, OR

TIE BAR PROTRUSIONS.

G. DRAWING FILENAME: MKT-MLP32Arev3.

Figure 7.

32-Lead, Molded Leadless Package (MLP), QUAD, JEDEC MO-220, Variation WHHD-4, 5mm Square

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without

notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the

most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein,

which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

Ordering Information

Part Number

Operating

Temperature Range

Eco Status

Package

Packing Method

FIN424CMLX

-30 to +85°C

Green

32-Lead, Molded Leadless Package (MLP), QUAD,

JEDEC MO-220, Variation WHHD-4, 5mm Square

Tape and Reel

FIN425CMLX

-30 to +85°C

Green

32-Lead, Molded Leadless Package (MLP), QUAD,

JEDEC MO-220, Variation WHHD-4, 5mm Square

Tape and Reel