© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5646 • Rev. 1.0.2

11

Physical Dimensions

BOTTOM VIEW

SIDE VIEWS

TOP VIEW

RECOMMENDED LAND PATTERN

BALL A1

INDEX AREA

A1

0.005

CA B

F

(NSMD PAD TYPE)

B

A

0.378±0.018

0.208±0.021

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCE

PER ASME Y14.5M, 1994.

D. DATUM C IS DEFINED BY THE SPHERICAL

CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS

±39 MICRONS (547-625 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILNAME: MKT-UC004ACrev2.

0.03 C

2X

0.03 C

2X

1 2

A

B

F

0.40

0.40

(X)±0.018

SEATING PLANE

C

0.625

0.547

0.06 C

0.05 C

E

D

D

E

0.40

0.40

Ø0.20

Cu Pad

Ø0.30

Solder Mask

(Y)±0.018

Ø0.260±0.020

4X

Figure 15. 4-Bump WLCSP, 0.4mm Pitch

Product-Specific Dimensions

Product

D

E X Y

FAN5646UC

0.820mm

0.820mm

0.210mm

0.210mm

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