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AD9915BCPZ Datasheet(PDF) 8 Page - Analog Devices |
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AD9915BCPZ Datasheet(HTML) 8 Page - Analog Devices |
8 / 48 page AD9915 Data Sheet Rev. A | Page 8 of 48 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating AVDD (1.8V), DVDD (1.8V) Supplies 2 V AVDD (3.3V), DVDD_I/O (3.3V) Supplies 4 V Digital Input Voltage −0.7 V to +4 V Digital Output Current 5 mA Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Maximum Junction Temperature 150°C Lead Temperature (10 sec Soldering) 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL PERFORMANCE Table 4. Symbol Description Value1 Unit JA Junction-to-ambient thermal resistance (still air) per JEDEC JESD51-2 24.1 °C/W JMA Junction-to-ambient thermal resistance (1.0 m/sec airflow) per JEDEC JESD51-6 21.3 °C/W JMA Junction-to-ambient thermal resistance (2.0 m/sec air flow) per JEDEC JESD51-6 20.0 °C/W JB Junction-to-board thermal resistance (still air) per JEDEC JESD51-8 13.3 °C/W JB Junction-to-board characterization parameter (still air) per JEDEC JESD51-6 12.8 °C/W JC Junction-to-case thermal resistance 2.21 °C/W JT Junction-to-top-of-package characterization parameter (still air) per JEDEC JESD51-2 0.23 °C/W 1 Results are from simulations. PCB is JEDEC multilayer. Thermal performance for actual applications requires careful inspection of the conditions in the application to determine if they are similar to those assumed in these calculations. ESD CAUTION |
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