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TGA2527-SM Datasheet(PDF) 9 Page - TriQuint Semiconductor |
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TGA2527-SM Datasheet(HTML) 9 Page - TriQuint Semiconductor |
9 / 13 page TGA2527-SM Ku-Band Power Amplifier Preliminary Data Sheet: Rev - 11/21/11 - 9 of 13 - Disclaimer: Subject to change without notice © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® Applications Information PC Board Layout Top RF layer is 0.008” thick Rogers RO4003, єr = 3.38. Metal layers are 1-oz copper. Microstrip 50 Ω line detail: width = 0.0175”. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical information, refer to the TGA2527-SM Product Information page. C1 C3 C4 R1 R2 C2 Bill of Material Ref Des Value Description Manufacturer Part Number C1, C2 100 pF Cap, 0402, 50 V, 5%, COG various C3, C4 1 uF Cap, 0603, 25 V, 10%, X5R various R1, R2 100K Ohms Res, 0603, 1/16W, 5%, SMD various |
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