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AD7392 Datasheet(PDF) 4 Page - Analog Devices |
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AD7392 Datasheet(HTML) 4 Page - Analog Devices |
4 / 11 page AD7392/AD7393 –4– REV. A PIN CONFIGURATIONS 14 13 12 11 17 16 15 20 19 18 10 9 8 1 2 3 4 7 6 5 TOP VIEW (Not to Scale) AD7392 VREF VOUT AGND DGND D11 D10 D9 D8 D7 D6 VDD SHDN CS RS D0 D1 D2 D3 D4 D5 14 13 12 11 17 16 15 20 19 18 10 9 8 1 2 3 4 7 6 5 TOP VIEW (Not to Scale) AD7393 VREF VOUT AGND DGND D9 D8 D7 D6 D5 D4 VDD SHDN CS RS NC NC D0 D1 D2 D3 NC = NO CONNECT PIN DESCRIPTION # Name Function 1VDD Positive Power Supply Input. Specified range of operation +2.7 V to +5.5 V. 2 SHDN Power Shutdown active low input. DAC regis- ter contents are saved as long as power stays on the VDD pin. When SHDN = 0, CS strobes will write new data into the DAC register. 3 CS Chip Select latch enable, active low. 4 RS Resets DAC register to zero condition. Asyn- chronous active low input. 5, 6 NC No connect Pins 5 and 6 on the AD7393. 17 DGND Digital Ground. 18 AGND Analog Ground. 19 VOUT DAC Voltage Output. 20 VREFIN DAC Reference Input Pin. Establishes DAC full-scale voltage. D0–D11 12 parallel input data bits. D11 = MSB Pin 16, D0 = LSB Pin 5, AD7392. D0–D9 10 parallel input data bits. D9 = MSB. Pin 16, D0 = LSB Pin 7, AD7393. ORDERING GUIDE Res Package Package Model (LSB) Temp Description Option AD7392AN 12 XIND 20-Lead P-DIP N-20 AD7392AR 12 XIND 20-Lead SOIC R-20 AD7393AN 10 XIND 20-Lead P-DIP N-20 AD7393AR 10 AUTO 20-Lead SOIC R-20 AD7393ARU 10 XIND TSSOP-20 RU-20 NOTES XIND = –40 °C to +85°C; AUTO = –40°C to +125°C. The AD7392 contains 709 transistors. The die size measures 78 mil × 85 mil = 6630 sq. mil. ABSOLUTE MAXIMUM RATINGS* VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V VOUT to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . 50 mA DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V Package Power Dissipation . . . . . . . . . . . . . (TJ max – TA)/ θ JA Thermal Resistance θ JA 20-Lead Plastic DIP Package (N-20) . . . . . . . . . . . 57 °C/W 20-Lead SOIC Package (R-20) . . . . . . . . . . . . . . . . 60 °C/W 20-Lead Thin-Shrink Surface Mount (RU-20) . . . 155 °C/W Maximum Junction Temperature (TJ max) . . . . . . . . . . 150 °C Operating Temperature Range . . . . . . . . . . . –40 °C to +85°C AD7393AR . . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +125°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature N-20 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . +300 °C R-20 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . .+215 °C RU-20 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . +220 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7392/AD7393 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. CS DB11–DB0 RS VOUT tCS DATA VALID 1 0 0 0 1 1 FS ZS tDS tDH tRS 0.1% FS ERROR BAND tS tS Figure 3. Timing Diagram DBX CS RS TO INTERNAL DAC SWITCHES 1 OF 12 LATCHES OF THE DAC REGISTER Figure 4. Digital Control Logic WARNING! ESD SENSITIVE DEVICE |
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