AD7822/AD7825/AD7829

–4–

REV. B

Parameter 5 V

10%

3 V

10%

Unit

Conditions/Comments

420

420

ns max

Conversion Time.

20

20

ns min

Minimum CONVST Pulsewidth.

30

30

ns min

Minimum time between the rising edge of RD and next falling edge of convert start.

110

110

ns max

EOC Pulsewidth.

70

70

ns min

10

10

ns max

RD rising edge to EOC pulse high.

0

0

ns min

CS to RD setup time.

0

0

ns min

CS to RD hold time.

30

30

ns min

Minimum RD Pulsewidth.

3

10

20

ns max

Data access time after RD low.

4

5

5

ns min

Bus relinquish time after RD high.

20

20

ns max

10

10

ns min

Address setup time before falling edge of RD.

15

15

ns min

Address hold time after falling edge of RD.

200

200

ns min

Minimum time between new channel selection and convert start.

25

25

µs typ

Power-up time from rising edge of CONVST using on-chip reference.

11

µs max

Power-up time from rising edge of CONVST using external 2.5 V reference.

NOTES

± 10%, and time required for

± 10%.

of the part and as such is independent of external bus loading capacitances.

ABSOLUTE MAXIMUM RATINGS

*

°C unless otherwise noted)

Analog Input Voltage to AGND

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW

θ

°C/W

Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . . 260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

θ

. . . . . . . . . . . . . . . . . . . . . 75

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7822/AD7825/AD7829 features proprietary ESD protection circuitry, perma-

nent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore,

proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE