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AD8042ACHIPS Datasheet(PDF) 5 Page - Analog Devices |
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AD8042ACHIPS Datasheet(HTML) 5 Page - Analog Devices |
5 / 16 page REV. C AD8042 –5– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4,000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8042 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V Internal Power Dissipation 2 Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . 1.3 W Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . 0.9 W Input Voltage (Common Mode) . . . . . . . . . . . . . ±VS ± 0.5 V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . ±3.4 V Output Short-Circuit Duration Observe Power Derating Curves Storage Temperature Range (N, R) . . . . . . . –65 ∞C to +125∞C Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 ∞C NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 Specification is for the device in free air: 8-Lead Plastic DIP Package: qJA = 90∞C/W 8-Lead SOIC Package: qJA = 155∞C/W MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8042 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic—approximately 150 ∞C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175 ∞C for an extended period can result in device failure. While the AD8042 is internally short-circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150 ∞C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves. AMBIENT TEMPERATURE ( C) 2.0 1.5 0 –50 90 –40 –30 –20 –10 0 10 20 30 50 60 70 80 40 1.0 0.5 8-LEAD PLASTIC-DIP PACKAGE 8-LEAD SOIC PACKAGE TJ = 150 C Figure 3. Maximum Power Dissipation vs. Temperature ORDERING GUIDE Temperature Package Package Model Range Description Option AD8042AN –40 ∞C to +85∞C 8-Lead DIP N-8 AD8042AR –40 ∞C to +85∞C 8-Lead SOIC SO-8 AD8042AR-REEL –40 ∞C to +85∞C 8-Lead SOIC 13" REEL SO-8 AD8042AR-REEL7 –40 ∞C to +85∞C 8-Lead SOIC 7" REEL SO-8 AD8042ARZ * –40 ∞C to +85∞C 8-Lead SOIC SO-8 AD8042ARZ-REEL * –40 ∞C to +85∞C 8-Lead SOIC 13" REEL SO-8 AD8042ARZ-REEL7 * –40 ∞C to +85∞C 8-Lead SOIC 7" REEL SO-8 AD8042ACHIPS DIE *Z = Pb-free part |
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