FAN54012UCX datasheet(5/36 Pages) FAIRCHILD

Part #	FAN54012UCX

Description	FAN54010 / FAN54011 / FAN54012 / FAN54013 / FAN54014

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Manufacturer	FAIRCHILD [Fairchild Semiconductor]

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FAN5401X Family • Rev. 1.0.4

5

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above

the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended

exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum

ratings are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

VBUS

VBUS Voltage

Continuous

–1.4

20.0

V

Pulsed, 100 ms Maximum Non-Repetitive

–2.0

VSTAT

STAT Voltage

–0.3

16.0

V

VI

PMID Voltage

7.0

V

SW, CSIN, VBAT, AUXPWR, DISABLE Voltage

–0.3

7.0

VO

Voltage on Other Pins

–0.3

6.5

(4)

V

dt

dVBUS

Maximum VBUS Slope above 5.5 V when Boost or Charger are Active

4

V/

s

ESD

Electrostatic Discharge

Protection Level

Human Body Model per JESD22-A114

2000

V

Charged Device Model per JESD22-C101

500

TJ

Junction Temperature

–40

+150

°C

TSTG

Storage Temperature

–65

+150

°C

TL

Lead Soldering Temperature, 10 Seconds

+260

°C

Note:

4.

Lesser of 6.5 V or VI + 0.3 V.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating

conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend

exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Max.

Unit

VBUS

Supply Voltage

4

6

V

VBAT(MAX) Maximum Battery Voltage when Boost enabled

4.5

V

dt

dVBUS



Negative VBUS Slew Rate during VBUS Short Circuit,

CMID < 4.7 µF (see VBUS Short While Charging)

TA < 60°C

4

V/

s

TA > 60°C

2

TA

Ambient Temperature

–30

+85

°C

TJ

Junction Temperature (see Thermal Regulation and Protection section)

–30

+120

°C

Thermal Properties

Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer

2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature

TJ(max) at a given ambient temperature TA. For measured data, see Table 11.

Symbol Parameter

Typical

Unit

JA

Junction-to-Ambient Thermal Resistance

60

°C/W

JB

Junction-to-PCB Thermal Resistance

20

°C/W

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