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ADF4001 Datasheet(PDF) 3 Page - Analog Devices |
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ADF4001 Datasheet(HTML) 3 Page - Analog Devices |
3 / 16 page REV. 0 ADF4001 –3– (AVDD = DVDD = 3 V 10%, 5 V 10%; AVDD ≤ VP ≤ 6.0 V ; AGND = DGND = CPGND= 0 V; RSET = 4.7 k ; TA = TMIN to TMAX unless otherwise noted; dBm referred to 50 .) CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE t1 t2 t3 t4 t6 t5 DB20 (MSB) DB19 DB2 DB1 (CONTROL BIT C2) CLOCK DATA LE LE DB0 (LSB) (CONTROL BIT C1) Figure 1. Timing Diagram TIMING CHARACTERISTICS Limit at TMIN to TMAX Parameter (B Version) Unit Test Conditions/Comments t1 10 ns min DATA to CLOCK Set Up Time t2 10 ns min DATA to CLOCK Hold Time t3 25 ns min CLOCK High Duration t4 25 ns min CLOCK Low Duration t5 10 ns min CLOCK to LE Set Up Time t6 20 ns min LE Pulsewidth NOTES Guaranteed by design but not production tested. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS 1, 2 (T A = 25 °C unless otherwise noted) AVDD to GND 3 . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to + 0.3 V VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V Digital I/O Voltage to GND . . . . . . . . . –0.3 V to VDD + 0.3 V Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to VP + 0.3 V REFIN, RFINA, RFINB to GND . . . . . . . –0.3 V to VDD + 0.3 V RFINA to RFINB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±320 mV Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . . . . 150 °C TSSOP θJA Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W CSP θJA Thermal Impedance (Paddle Soldered) . . . . 122°C/W CSP θ JA Thermal Impedance (Paddle Not Soldered) . . 216 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2This device is a high-performance RF integrated circuit with an ESD rating of < 2 k Ω and it is ESD sensitive. Proper precautions should be taken for handling and assembly. 3GND = AGND = DGND = 0 V. ORDERING GUIDE Model Temperature Range Package Description Package Option ADF4001BRU –40 °C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-16 ADF4001BCP –40 °C to +85°C Chip Scale Package * CP-20 *Contact factory for chip availability. |
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