Introduction to Circuit Protection

Introduction to Circuit Protection

Transientology

© 2012 Littelfuse, Inc.

Specifications are subject to change without notice.

Surface Mount Fuses

459 Series

Please refer to www.littelfuse.com/series/459.html for current information.

Materials

Body: Molded Thermoplastic

Terminations: 100% Tin-plated Copper

(459 Series)

Solderability

MIL-STD-202, Method 208

Product Marking

Body: Brand Logo, Current Rating, Voltage

Rating, Series Code, Date Code, Agency

Approved Logo

Moisture

Sensitivity Level

Level 1 J-STD - 020C

Operating

Temperature

Product Characteristics

Shock

MIL-STD-202, Method 213, Test

Condition I (100 G’s peak for 6 msecs.)

Vibration

MIL-STD-202, Method 201

(10–55 Hz, 0.06 inch total excursion)

Salt Spray

MIL-STD-202, Method 101,

Test Condition B (48 hours)

Insulation Resistance

(After Opening)

MIL-STD-202, Method 302,

(10,000 ohms minimum at 100 volts)

Thermal Shock

MIL-STD-202, Method 107,

Test Condition B (–65 to 125°C)

Moisture Resistance

MIL-STD-202, Method 106, High

Humidity (90-98 RH), Heat (65°C)

Average Time Current Curves

100

10

1

0.1

0.01

0.001

0.05 0.1

1

10

100

CURRENT IN AMPERES

Soldering Parameters

Temperature Rerating Curve

1. Rerating depicted in this curve is in addition to the standard rerating of 25% for

continuous operation.

Wave Soldering

260°C, 10 seconds max.

Reflow Soldering

260°C, 30 seconds max.