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CMP401GP Datasheet(PDF) 4 Page - Analog Devices |
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CMP401GP Datasheet(HTML) 4 Page - Analog Devices |
4 / 8 page CMP401/ CMP402 REV. 0 –4– WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the CMP401/CMP402 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS 1 Total Analog Supply Voltage . . . . . . . . . . . . . . . . . . . . . +16 V Digital Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V Analog Positive Supply—Digital Positive Supply . . . . –200 mV Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7 V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±9 V Output Short-Circuit Duration to GND . . . . . . . . . Indefinite Storage Temperature Range P, S, RU Package . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range CMP401G, CMP402G . . . . . . . . . . . . . . –40 °C to +125°C Junction Temperature Range P, S, RU Package . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300 °C Package Type JA 3 JC Units 16-Pin Plastic DIP (P) 90 47 °C/W 16-Pin SO (S) 113 37 °C/W 16-Lead TSSOP (RU) 180 37 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2The analog input voltage is equal to ± 7 volts or the analog supply voltage, whichever is less. 3 θ JA is specified for the worst case conditions, i.e., θ JA is specified for device in socket for P-DIP, and θ JA is specified for device soldered in circuit board for SOIC and TSSOP packages. ORDERING GUIDE Temperature Package Package Model Range Description Option CMP401GP –40 °C to +125°C 16-Pin Plastic DIP N-16 CMP401GS –40 °C to +125°C 16-Pin SOIC R-16A CMP401GRU –40 °C to +125°C 16-Lead TSSOP RU-16 CMP402GP –40 °C to +125°C 16-Pin Plastic DIP N-16 CMP402GS –40 °C to +125°C 16-Pin SOIC R-16A CMP402GRU –40 °C to +125°C 16-Lead TSSOP RU-16 DICE CHARACTERISTICS 2 1 16 15 89 3 4 5 6 7 14 13 12 11 10 CMP401/CMP402 Die Size 0.065 × 0.069 inch, 4,485 sq. mils Substrate (Die Backside) Is Connected to V+ Transistor Count 104. +IN –IN V+ ANA V– ANA V+ DIG OUT DIG GND Figure 1. Simplified Schematic CMP401/CMP402 PIN CONFIGURATIONS 16-Lead Epoxy DIP (P Suffix) 16-Lead Narrow-SO (S Suffix) 16-Lead TSSOP (RU Suffix) OUT B OUT A V+ DIG V+ ANA –IN A +IN A –IN B +IN B V– ANA DIG GND OUT D OUT C –IN C +IN D –IN D +IN C 116 8 9 TOP VIEW (Not to Scale) CMP401/ 402 14 13 12 11 16 15 10 9 8 1 2 3 4 7 6 5 OUT B OUT A V+ DIG V+ ANA –IN A +IN A –IN B +IN B V– ANA DIG GND OUT D OUT C –IN C +IN D –IN D +IN C TOP VIEW (Not to Scale) CMP401/ 402 14 13 12 11 16 15 10 9 8 1 2 3 4 7 6 5 OUT B OUT A V+ DIG V+ ANA –IN A +IN A –IN B +IN B V– ANA DIG GND OUT D OUT C –IN C +IN D –IN D +IN C |
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