bq294700, bq294701, bq294702

bq294703, bq294704, bq294705

SLUSB15 – SEPTEMBER 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

Package

OV Hysteresis

Tape and Reel

Part Number

Package

OVP (V)

Output Drive

Designator

(V)

(Large)

bq294700

4.350

0.300

CMOS Active High

bq294700DSGR

bq294701

4.250

0.300

CMOS Active High

bq294701DSGR

bq294702

4.300

0.300

CMOS Active High

bq294702DSGR

bq294703

4.325

0.300

CMOS Active High

bq294703DSGR

–40°C to

8-pin

DSG

bq294704

4.400

0.300

CMOS Active High

bq294704DSGR

110°C

SON

bq294705

4.450

0.300

CMOS Active High

bq294705DSGR

CMOS Active High

3.850–4.600

0–0.300

or Open Drain

bq2947xyTBD

Active Low

(1)

Future option, contact TI.

THERMAL INFORMATION

bq2947xy

SON

UNITS

8 PINS

Junction-to-ambient thermal resistance

62

Junction-to-case(top) thermal resistance

72

Junction-to-board thermal resistance

32.5

°C/W

Junction-to-top characterization parameter

1.6

Junction-to-board characterization parameter

33

Junction-to-case(bottom) thermal resistance

10

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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