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AN-1161 Datasheet(PDF) 4 Page - Analog Devices

Part # AN-1161
Description  EMC-Compliant RS-485 Communication Networks
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AN-1161 Datasheet(HTML) 4 Page - Analog Devices

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AN-1161
Application Note
Rev. 0 | Page 4 of 16
ELECTROMAGNETIC COMPATIBILITY
EMC is the ability of an electronic system to function satis-
factorily in its intended electromagnetic environment without
introducing intolerable electromagnetic disturbances to that
environment. An electromagnetic environment is composed of
both radiated and conducted energy. Therefore, EMC has two
aspects, emission and susceptibility.
Emission is the unwanted generation of electromagnetic energy
by a product. It is often desirable to control emission in order to
create an electromagnetically-compatible environment.
Susceptibility is a measure of the ability of electronic products
to tolerate the influence of electromagnetic energy radiated or
conducted from other electronic products or electromagnetic
influences. Immunity is the opposite of susceptibility.
Equipment that has high susceptibility has low immunity.
The international electrotechnical commission (IEC) is the
world’s leading organization that prepares and publishes
international standards for all electrical, electronic, and related
technologies. Since 1996, all electronic equipment sold to or
within the European community must meet EMC levels as
defined in specification IEC 61000-4-x.
The IEC 61000 specifications define the set of EMC immunity
requirements that apply to electrical and electronic equipment
intended for use in residential, commercial, and light industrial
environments. Within this set of specifications, there are three
types of high voltage transients that electronic designers need to
be concerned about for data communication lines. These are
IEC 61000-4-2 Electrostatic Discharge (ESD)
IEC 61000-4-4 Electrical Fast Transients (EFT)
IEC 61000-4-5 Surge Immunity
This application note deals with increasing the protection level
of RS-485 ports to protect against the these three main EMC
transients.
Each of these specifications defines a test method to assess
the immunity of electronic and electrical equipment against
the defined phenomenon. The following sections provide a
summary of each of these tests.
ELECTROSTATIC DISCHARGE
ESD is the sudden transfer of electrostatic charge between
bodies at different potentials caused by near contact or induced
by an electric field. It has the characteristics of high current in a
short time period.
An object can become charged due to a number of mechanisms.
A charge can occur by simple contact with another charged
object. It can also occur as a result of triboelectric charging,
which is the generation of static electricity caused by rubbing
two substances together. Alternatively, an object can be charged
as a result of induction charging. In this case, there is no
physical contact with the charged object yet charging can occur
if it is within the electric field of the charged object.
The primary purpose of the IEC 61000-4-2 test is to determine
the immunity of systems to external ESD events outside the
system during operation. IEC 61000-4-2 specifies testing using
two coupling methods, contact discharge and air-gap discharge.
Contact discharge implies the discharge gun is placed in direct
connection with the unit under tested. Air gap discharge uses a
higher test voltage, but does not make direct contact with the unit
under test.
During air discharge testing, the charged electrode of the
discharge gun is moved toward the unit under test until a
discharge occurs as an arc across the air gap. The discharge
gun does not make direct contact with the unit under test. A
number of factors affect the results and repeatability of the air
discharge test, including humidity, temperature, barometric
pressure, distance, and rate of approach to the unit under test.
This method is a better representation of an actual ESD event,
but is not as repeatable. Therefore, contact discharge is the
preferred test method.
IEC 61000-4-2 specifies voltage test levels for different environ-
mental conditions along with a current waveform. Table 1
shows the relationship between the environment and the test
voltage. The test levels should be selected in accordance with
the most realistic installation and environment conditions the
final product will be subjected to.
Level 1 is the least severe and Level 4 the most severe. Level 1
and Level 2 are for products installed in controlled environ-
ments that have antistatic material. Level 3 and Level 4 are for
products installed in more severe environments where ESD
events with higher voltages are more common.
Figure 2 shows the 8 kV contact discharge current waveform
as described in the specification. Some of the key waveform
parameters to note are fast rise times of less than 1 ns and short
pulse widths of approximately 60 ns. This equates to a pulse
with total energy in the range of tens of mJ.
The test is performed with single discharges. The test point is
subjected to at least 10 positive and 10 negative discharges. A 1 s
interval between discharges is recommended.


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