TLC59731

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SBVS222 – FEBRUARY 2013

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

MIN

MAX

UNIT

VCC

–0.3

+7.0

V

SDI

–0.3

V

OUT0 to OUT2

–0.3

+21

V

SDO

–0.3

+7.0

V

Current

OUT0 to OUT2

0

+60

mA

–40

+150

°C

Temperature

–55

+150

°C

Human body model (HBM)

8000

V

Electrostatic discharge (ESD) ratings:

Charged device model (CDM)

2000

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

THERMAL INFORMATION

TLC59731

D

UNITS

(SO)

8 PINS

Junction-to-ambient thermal resistance

134.6

Junction-to-case (top) thermal resistance

88.6

Junction-to-board thermal resistance

75.3

°C/W

Junction-to-top characterization parameter

37.7

Junction-to-board characterization parameter

74.8

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright © 2013, Texas Instruments Incorporated

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