* All specifications and photos are subject to change without notice.

67

CEM831

Intel

2 Module with Intel

Chipset

I/O

Ordering Information

Packing List

System

MIO

1 x PATA-100 IDE

1 x LPC interface

SATA

2 x SATA-150 ports

Hardware Monitoring

N/A

Ethernet

1 port as 10/100/1000Mbps supports Auto MDI-X,

Wake-on-LAN, RPL/PXE Boot ROM with Intel 82583V

Audio

HD/AC'97 link interface to baseboard for external Codec

USB

8 x USB 2.0

SMBus

Yes

GPIO

4 channels IN & 4 channles OUT

Standard

CEM831VG-N270

(P/N: E38D831100)

(Fanless)

COM Express type 2 module with Intel

VGA, LVDS, and 10/100/1000Mbps Ethernet

Optional

CEB94000

ATX form factor baseboard

5078D831000E

CEM831 Heatspreader

5078D830100E

COM Express SoM cooling kit with fan

5078D830200E

COM Express SoM cooling kit without fan

Quick installation guide, user's manual/utility CD

CPU

Intel

FSB 533 MHz

System Memory

2 x 200-pin SO-DIMM supports DDR2-533/667 max.

up to 4 GB

Chipset

Intel

BIOS

AMI

SSD

N/A

Watchdog Timer

255 levels, 1~255 sec.

Expansion Interface

1 x PCIe x16 graphics port supports for SDVO or PCIe x1

devices

3 x PCIe lanes support for 3 x PCIe x1 devices (ICH7M)

5 x PCIe lanes support for 5 x PCIe x1 or 1 x PCIe x4 +

1 x PCIe x1 devices (ICH7M-DH)

4 x 32-bit PCI bus masters

Battery

N/A

Power Requirements

Intel

Max. RMS: +12V @ 1.171A

Size

125 x 95 mm

Board Thickness

1.6 mm

Temperature

0° ~ +60°C (32°F ~ 140°F), operation

Relative Humidity

10% ~ 95% relative humidity, non-condensing

Features

Double Deck DDR2 SO-DIMM

Rear view

DualView

Low Power

Fanless

Display

Chipset

Intel

Memory Size

Intel

Display Interface

1 x VGA

1 x LVDS; 18/24-bit single/dual channel