PRODUCT SPECIFICATION

REVISION:

ECR/ECN INFORMATION:

SHEET No.

EC No:

UCP2011-0141

C1

DATE:

2010 /07/15

TITLE:

PRODUCT SPECIFICATION FOR

MINI-FIT PLUS HCS

CONNECTOR SYSTEM

DOCUMENT NUMBER:

CREATED / REVISED BY:

CHECKED BY:

APPROVED BY:

PS-45750-001

BWIRKUS

BWIRKUS

APATEL

TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC

2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS

For details regarding dimensions, materials and terminal platings, refer to the appropriate

sales drawings for further information.

2.3 SAFETY AGENCY APPROVALS

UL File: E29179

CSA Certificate: LR19980

TUV Certificate: R72081037

3.0 APPLICABLE STANDARDS AND SPECIFICATIONS

- EIA-364-1000

- Molex solderability specification SMES-152

4.0 PACKAGING

Parts shall be packaged to protect against damage during normal handling, transit and storage. For

details refer to the Packaging Specification as called out on the applicable product Sales Drawing.

5.0 RATINGS

5.1 VOLTAGE

600 Volts AC RMS or 600 Volts DC

5.2 APPLICABLE WIRES

WIRE GAUGE

INSULATION DIAMETER

16 AWG

1.80-3.10 millimeters / .071-.122 inches

18-20 AWG

1.65-2.95 millimeters / .065-.116 inches

5.3 TEMPERATURE RATING

Mini-Fit Plus HCS has a field temperature of 65°C and field life rating for 10 years based on

testing per EIA-364-17B, Method A.

5.4 WAVE SOLDER PROCESS TEMPERATURE

Headers with molded pegs: 240°C MAX.

Headers without pegs: 265°C MAX

5.5 DURABILITY (MATING CYCLES)

Tin:

100 cycles

Gold: 250 cycles

Durability ratings established as tested per Durability Test Procedures described by EIA-364-09C

and meet requirements for low level contact resistance and DWV as prescribed per EIA-364-1000

Test Sequence Group 7.